Low dielectric adhesive "ZLP"
Reduce transmission loss with high-speed communication FPC! Thermosetting adhesive sheet that can be stored at room temperature.
"ZLP" is a low-dielectric adhesive material available in adhesive sheet form, which can be bonded with various materials such as copper and polyimide. It is a thermosetting adhesive sheet that can be stored at room temperature, and there are two bonding methods: "roll lamination method" and "sheet quick press method." Due to its low dielectric constant and low dielectric loss tangent, it can reduce transmission loss in high-speed communication FPCs. [Adhesive Curing Conditions] ■ Oven Cure (without pressure): 180°C × 90 min at atmospheric pressure ■ Press Cure (with pressure): 180°C × 90 min at 2.0 MPa *For more details, please refer to the PDF document or feel free to contact us.
- Company：パナック
- Price：Other
